High-capacity DDR3 memory ruggedized for advanced mission computing and sensor processing applicationsANDOVER, Mass. – March 23, 2017 – Mercury Systems, Inc. (NASDAQ: MRCY, www.mrcy.com), announced volume production of its newest high density secure memory device, embedding 8GB of double data rate third-generation synchronous dynamic random-access memory (DDR3 SDRAM) in a military-hardened ball grid array (BGA) package. Available in both x64 and x72 architectures, Mercury’s latest product is the defense industry’s highest capacity ruggedized memory device. Offering a 40% reduction in physical footprint over discrete components packages, this new offering is ideally suited for high-performance computing systems demanding SWaP-optimized memory with data transfer speeds up to 1600 Mb/s.
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8GB DDR3 High Density Secure Memory Device press release