Micro-Precision Technologies, Inc.


Contract manufacturer of custom microelectronics assemblies, including thick-film ceramic substrates, hybrid microelectronic assemblies, custom semiconductors, high-rel and harsh environment semiconductor packaging and legacy/obsolete semiconductor mitigation.



Hybrid Assembly

Assembly of Hybrids and other microelectronic modules.

Thick-Film Ceramic Substrates

Multi-layer thick-film ceramic substrates for hi-rel and harsh environment electronics.

FR-4 to Ceramic conversion

Convert FR-4 PCB to ceramic for high temperature operation.

Wire bond and Die attach

Wire bond and die attach assembly services and semiconductor packaging.