Contract manufacturer of custom microelectronics assemblies, including thick-film ceramic substrates, hybrid microelectronic assemblies, custom semiconductors, high-rel and harsh environment semiconductor packaging and legacy/obsolete semiconductor mitigation.
http://www.micropt.comAssembly of Hybrids and other microelectronic modules.
Multi-layer thick-film ceramic substrates for hi-rel and harsh environment electronics.
Convert FR-4 PCB to ceramic for high temperature operation.
Wire bond and die attach assembly services and semiconductor packaging.
Assembly of Hybrids and other microelectronic modules.
Multi-layer thick-film ceramic substrates for hi-rel and harsh environment electronics.
Convert FR-4 PCB to ceramic for high temperature operation.
Wire bond and die attach assembly services and semiconductor packaging.