Micro-Precision Technologies, Inc.
Contract manufacturer of custom microelectronics assemblies, including thick-film ceramic substrates, hybrid microelectronic assemblies, custom semiconductors, high-rel and harsh environment semiconductor packaging and legacy/obsolete semiconductor mitigation. http://www.micropt.com
Products/Services Hybrid Assembly
Assembly of Hybrids and other microelectronic modules. Thick-Film Ceramic Substrates
Multi-layer thick-film ceramic substrates for hi-rel and harsh environment electronics. FR-4 to Ceramic conversion
Convert FR-4 PCB to ceramic for high temperature operation. Wire bond and Die attach
Wire bond and die attach assembly services and semiconductor packaging.